View SN74AHC4066NE4_9083159.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 1 post office box 655303 ? dallas, texas 75265 2-v to 5.5-v v cc operation supports mixed-mode voltage operation on all ports high on-off output-voltage ratio low crosstalk between switches individual switch controls extremely low input current esd protection exceeds jesd 22 ? 2000-v human-body model (a114-a) ? 200-v machine model (a115-a) ? 1000-v charged-device model (c101) description/ordering information this quadruple silicon-gate cmos analog switch is designed for 2-v to 5.5-v v cc operation. this switch is designed to handl e both analog and digital signals. each switch permits signals with amplitudes up to 5.5 v (peak) to be transmitted in either direction. each switch section has its own enable-input control (c). a high-level voltage applied to c turns on the associated switch section. applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. ordering information t a package ? orderable part number top-side marking pdip ? n tube sn74ahc4066n sn74ahc4066n qfn ? rgy tape and reel sn74ahc4066rgyr ha4066 soic d tube sn74ahc4066d ahc4066 soic ? d tape and reel sn74ahc4066dr ahc4066 sop ns tube sn74ahc4066ns ahc4066 ?40 c to 85 c sop ? ns tape and reel sn74ahc4066nsr ahc4066 ssop db tube sn74ahc4066db ha4066 ssop ? db tape and reel sn74ahc4066dbr ha4066 tssop pw tube sn74ahc4066pw ha4066 tssop ? pw tape and reel sn74ahc4066pwr ha4066 tvsop ? dgv tape and reel sn74ahc4066dgvr ha4066 ? package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. copyright ? 2003, texas instruments incorporated please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 5 6 7 14 13 12 11 10 9 8 1a 1b 2b 2a 2c 3c gnd v cc 1c 4c 4a 4b 3b 3a d, db, dgv, n, ns, or pw package (top view) rgy package (top view) 114 78 2 3 4 5 6 13 12 11 10 9 1c 4c 4a 4b 3b 1b 2b 2a 2c 3c 1a 3a v gnd cc nc ? no internal connection production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 2 post office box 655303 ? dallas, texas 75265 function table (each switch) input control (c) switch l off h on logic diagram (positive logic) a v cc v cc b one of four switches c absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage range, v cc (see note 1) ?0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage range, v i (see note 1) ?0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . switch i/o voltage range, v io (see notes 1 and 2) ?0.5 v to v cc + 0.5 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . control-input clamp current, i ik (v i < 0) ?20 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i/o diode current, i iok (v io < 0 or v io > v cc ) 50 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . on-state switch current, i t (v io = 0 to v cc ) 25 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous current through v cc or gnd 50 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, ja (see note 3): d package 86 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (see note 3): db package 96 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (see note 3): dgv package 127 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (see note 3): n package 80 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (see note 3): ns package 76 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (see note 3): pw package 113 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (see note 4): rgy package 47 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. the input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. this value is limited to 5.5 v maximum. 3. the package thermal impedance is calculated in accordance with jesd 51-7. 4. the package thermal impedance is calculated in accordance with jesd 51-5.
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 3 post office box 655303 ? dallas, texas 75265 recommended operating conditions (see note 5) min max unit v cc supply voltage 2 ? 5.5 v v cc = 2 v 1.5 v high level input voltage control inputs v cc = 2.3 v to 2.7 v v cc 0.7 v v ih high-level input voltage, control inputs v cc = 3 v to 3.6 v v cc 0.7 v v cc = 4.5 v to 5.5 v v cc 0.7 v cc = 2 v 0.5 v low level input voltage control inputs v cc = 2.3 v to 2.7 v v cc 0.3 v v il low-level input voltage, control inputs v cc = 3 v to 3.6 v v cc 0.3 v v cc = 4.5 v to 5.5 v v cc 0.3 v i control input voltage 0 5.5 v v io input/output voltage 0 v cc v v cc = 2.3 v to 2.7 v 200 t/ v input transition rise or fall rate v cc = 3 v to 3.6 v 100 ns/v t/ v input transition rise or fall rate v cc = 4.5 v to 5.5 v 20 ns/v t a operating free-air temperature ?40 85 c ? with supply voltages at or near 2 v, the analog switch on-state resistance becomes very nonlinear. only digital signals should be transmitted at these low supply voltages. note 5: all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs , literature number scba004.
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 4 post office box 655303 ? dallas, texas 75265 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions v t a = 25 c min max unit parameter test conditions v cc min typ max min max unit i t = ?1 ma, 2.3 v 38 180 225 r on on-state switch resistance t , v i = v cc or gnd, v c =v ih 3 v 29 150 190 on sw it c h res i s t ance v c = v ih (see figure 1) 4.5 v 21 75 100 pk i t =? 1 ma, 2.3 v 143 500 600 r on (p) peak on - state resistance i t = ? 1 ma , v i = v cc to gnd, 3 v 57 180 225 r on(p) on-s t a t e res i s t ance v i v cc to gnd, v c = v ih 4.5 v 31 100 125 r on difference in on-state resistance i t = ? 1 ma , v i = v cc to gnd, 3 v 3 20 30 r on on state resistance between switches v i v cc to gnd, v c = v ih 4.5 v 2 15 20 0.1 1 a i s(off) off-state switch leakage current v i = v cc and v o = gnd, or v i = gnd and v o = v cc , v c = v il (see figure 2) 5.5 v 0.1 1 a i s(on) on-state switch leakage current v i = v cc or gnd, v c = v ih (see figure 3) 5.5 v 0.1 1 a i cc supply current v i = v cc or gnd 5.5 v 20 a c ic control input capacitance 1.5 pf c io switch input/output capacitance 5.5 pf c f feed-through capacitance 0.5 pf
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 5 post office box 655303 ? dallas, texas 75265 switching characteristics over recommended operating free-air temperature range, v cc = 2.5 v 0.2 v (unless otherwise noted) parameter from to test t a = 25 c min max unit parameter from (input) to (output) test conditions min typ max min max unit t plh t phl propagation delay time a or b b or a c l = 15 pf, (see figure 4) 1.2 10 16 ns t pzh t pzl switch turn-on time c a or b c l = 15 pf, r l = 1 k (see figure 5) 3.3 15 20 ns t plz t phz switch turn-off time c a or b c l = 15 pf, r l = 1 k (see figure 5) 6 15 23 ns t plh t phl propagation delay time a or b b or a c l = 50 pf, (see figure 4) 2.6 12 18 ns t pzh t pzl switch turn-on time c a or b c l = 50 pf, r l = 1 k (see figure 5) 4.2 25 32 ns t plz t phz switch turn-off time c a or b c l = 50 pf, r l = 1 k (see figure 5) 9.6 25 32 ns switching characteristics over recommended operating free-air temperature range, v cc = 3.3 v 0.3 v (unless otherwise noted) parameter from to test t a = 25 c min max unit parameter from (input) to (output) test conditions min typ max min max unit t plh t phl propagation delay time a or b b or a c l = 15 pf, (see figure 4) 0.8 6 10 ns t pzh t pzl switch turn-on time c a or b c l = 15 pf, r l = 1 k (see figure 5) 2.3 11 15 ns t plz t phz switch turn-off time c a or b c l = 15 pf, r l = 1 k (see figure 5) 4.5 11 15 ns t plh t phl propagation delay time a or b b or a c l = 50 pf, (see figure 4) 1.5 9 12 ns t pzh t pzl switch turn-on time c a or b c l = 50 pf, r l = 1 k (see figure 5) 3 18 22 ns t plz t phz switch turn-off time c a or b c l = 50 pf, r l = 1 k (see figure 5) 7.2 18 22 ns
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 6 post office box 655303 ? dallas, texas 75265 switching characteristics over recommended operating free-air temperature range, v cc = 5 v 0.5 v (unless otherwise noted) parameter from to test t a = 25 c min max unit parameter from (input) to (output) test conditions min typ max min max unit t plh t phl propagation delay time a or b b or a c l = 15 pf, (see figure 4) 0.3 4 7 ns t pzh t pzl switch turn-on time c a or b c l = 15 pf, r l = 1 k (see figure 5) 1.6 7 10 ns t plz t phz switch turn-off time c a or b c l = 15 pf, r l = 1 k (see figure 5) 3.2 7 10 ns t plh t phl propagation delay time a or b b or a c l = 50 pf, (see figure 4) 0.6 6 8 ns t pzh t pzl switch turn-on time c a or b c l = 50 pf, r l = 1 k (see figure 5) 2.1 12 16 ns t plz t phz switch turn-off time c a or b c l = 50 pf, r l = 1 k (see figure 5) 5.1 12 16 ns analog switch characteristics over operating free-air temperature range (unless otherwise noted) parameter from to (output test v t a = 25 c unit parameter from (input) (output ) test conditions v cc min typ max unit f c l = 50 pf, r l = 600 , 2.3 v 30 frequency response (switch on) a or b b or a c l = 50 pf , r l = 600 , f i = 1 mhz (sine wave) (see figure 7) 3 v ?45 db (b e t ween any sw it c h es ) a or b b or a f in = 1 mhz (sine wave) (see figure 7) 4.5 v ?45 db crosstalk 2.3 v 15 crosstalk (control input to c a or b c l = 50 pf, r l = 600 , f i = 1 mhz (square wave) (see figure 8) 3 v 20 mv (control input to signal output) c a or b f in = 1 mhz (square wave) (see figure 8) 4.5 v 50 mv fdth htt ti 2.3 v ?40 feed-through attenuation (switch off) a or b b or a c l = 50 pf, r l = 600 , f in = 1 mhz (see figure 9) 3 v ?40 db ( sw it c h o ff) a or b b or a (see figure 9) 4.5 v ?40 db c l =50pfr l =10k operating characteristics, t a = 25 c parameter test conditions typ unit c pd power dissipation capacitance c l = 50 pf, f = 10 mhz 4.5 pf
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 7 post office box 655303 ? dallas, texas 75265 parameter measurement information v cc v i = v cc or gnd v c = v ih 1 ma v o r on v i ?v o 10 ?3 v i ? v o v cc gnd (on) v figure 1. on-state resistance test circuit v cc v c = v il v i v o condition 1: v i = 0, v o = v cc condition 2: v i = v cc , v o = 0 v cc gnd (off) a figure 2. off-state switch leakage-current test circuit v cc v c = v ih v i open v i = v cc or gnd v cc gnd (on) a figure 3. on-state leakage-current test circuit
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 8 post office box 655303 ? dallas, texas 75265 parameter measurement information v cc v c = v ih v i v o c l test circuit t plh t phl 50% 50% v cc 0 v 50% 50% v oh v ol v i a or b v o b or a voltage waveforms 50 t r 90% 10% t f 10% 90% v cc gnd (on) figure 4. propagation delay time, signal input to signal output
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 9 post office box 655303 ? dallas, texas 75265 parameter measurement information c l v cc v i v o test circuit t plz 50% voltage waveforms r l = 1 k v ol + 0.3 v s1 s2 t pzh t phz 50% 50% 50% t pzl t pzh t plz t phz gnd v cc gnd v cc test s1 s2 v cc gnd v cc gnd t pzl 50% v cc v o 50% 0 v v ol v c (t pzl , t pzh ) (t plz , t phz ) v cc v o 0 v v ol v c v cc 0 v v oh v cc 0 v 0 v v oh v oh ? 0.3 v 0 v v cc v cc v c 50 gnd v cc figure 5. switching time (t pzl , t plz, t pzh , t phz ), control to signal output
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 10 post office box 655303 ? dallas, texas 75265 parameter measurement information v o v cc 50 f in v cc 0.1 f v i v cc gnd (on) r l = 600 c l = 50 pf v cc /2 figure 6. frequency response (switch on) v o1 r l = 600 c l = 50 pf v cc 50 f in v cc /2 v c = v cc 0.1 f v i v i v o2 v cc 600 v cc /2 v c = gnd 600 v cc gnd (on) v cc gnd (off) r l = 600 c l = 50 pf figure 7. crosstalk between any two switches v o v cc v cc gnd r l = 600 c l = 50 pf v cc /2 v cc /2 50 v c 600 figure 8. crosstalk (control input ? switch output)
sn74ahc4066 quadruple bilateral analog switch scls511 ? june 2003 11 post office box 655303 ? dallas, texas 75265 parameter measurement information v o r l = 600 c l = 50 pf v cc v cc /2 v c = gnd 0.1 f v i f in v cc gnd (off) v cc /2 600 50 figure 9. feed-through attenuation (switch off) v o r l = 10 k c l = 50 pf v cc v cc /2 v c = v cc 10 f v i f in v cc gnd (on) 600 10 f figure 10. sine-wave distortion
package option addendum www.ti.com 10-jun-2014 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples sn74ahc4066d active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ahc4066 sn74ahc4066dbr active ssop db 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ha4066 sn74ahc4066dbrg4 active ssop db 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ha4066 sn74ahc4066dg4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ahc4066 sn74ahc4066dgvr active tvsop dgv 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ha4066 sn74ahc4066dr active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ahc4066 sn74ahc4066n active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type -40 to 85 sn74ahc4066n SN74AHC4066NE4 active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type -40 to 85 sn74ahc4066n sn74ahc4066nsr active so ns 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ahc4066 sn74ahc4066nsrg4 active so ns 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ahc4066 sn74ahc4066pw active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ha4066 sn74ahc4066pwr active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ha4066 sn74ahc4066pwre4 active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ha4066 sn74ahc4066rgyr active vqfn rgy 14 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 85 ha4066 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device.
package option addendum www.ti.com 10-jun-2014 addendum-page 2 (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74ahc4066dbr ssop db 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 q1 sn74ahc4066dgvr tvsop dgv 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 q1 sn74ahc4066dr soic d 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 q1 sn74ahc4066nsr so ns 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 q1 sn74ahc4066pwr tssop pw 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 sn74ahc4066rgyr vqfn rgy 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 q1 package materials information www.ti.com 14-jul-2012 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) sn74ahc4066dbr ssop db 14 2000 367.0 367.0 38.0 sn74ahc4066dgvr tvsop dgv 14 2000 367.0 367.0 35.0 sn74ahc4066dr soic d 14 2500 367.0 367.0 38.0 sn74ahc4066nsr so ns 14 2000 367.0 367.0 38.0 sn74ahc4066pwr tssop pw 14 2000 367.0 367.0 35.0 sn74ahc4066rgyr vqfn rgy 14 3000 367.0 367.0 35.0 package materials information www.ti.com 14-jul-2012 pack materials-page 2

mechanical data mpds006c february 1996 revised august 2000 post office box 655303 ? dallas, texas 75265 dgv (r-pdso-g**) plastic small-outline 24 pins shown 14 3,70 3,50 4,90 5,10 20 dim pins ** 4073251/e 08/00 1,20 max seating plane 0,05 0,15 0,25 0,50 0,75 0,23 0,13 112 24 13 4,30 4,50 0,16 nom gage plane a 7,90 7,70 38 24 16 4,90 5,10 3,70 3,50 a max a min 6,60 6,20 11,20 11,40 56 9,60 9,80 48 0,08 m 0,07 0,40 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. d. falls within jedec: 24/48 pins mo-153 14/16/20/56 pins mo-194

mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? products. buyers are responsible for their products and applications using ti components. to minimize the risks associated with buyers ? products and applications, buyers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which ti components or services are used. information published by ti regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of significant portions of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti components or services with statements different from or beyond the parameters stated by ti for that component or service voids all express and any implied warranties for the associated ti component or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of ti components in its applications, notwithstanding any applications-related information or support that may be provided by ti. buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. buyer will fully indemnify ti and its representatives against any damages arising out of the use of any ti components in safety-critical applications. in some cases, ti components may be promoted specifically to facilitate safety-related applications. with such components, ti ? s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. nonetheless, such components are subject to these terms. no ti components are authorized for use in fda class iii (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. only those ti components which ti has specifically designated as military grade or ? enhanced plastic ? are designed and intended for use in military/aerospace applications or environments. buyer acknowledges and agrees that any military or aerospace use of ti components which have not been so designated is solely at the buyer ' s risk, and that buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti has specifically designated certain components as meeting iso/ts16949 requirements, mainly for automotive use. in any case of use of non-designated products, ti will not be responsible for any failure to meet iso/ts16949. products applications audio www.ti.com/audio automotive and transportation www.ti.com/automotive amplifiers amplifier.ti.com communications and telecom www.ti.com/communications data converters dataconverter.ti.com computers and peripherals www.ti.com/computers dlp ? products www.dlp.com consumer electronics www.ti.com/consumer-apps dsp dsp.ti.com energy and lighting www.ti.com/energy clocks and timers www.ti.com/clocks industrial www.ti.com/industrial interface interface.ti.com medical www.ti.com/medical logic logic.ti.com security www.ti.com/security power mgmt power.ti.com space, avionics and defense www.ti.com/space-avionics-defense microcontrollers microcontroller.ti.com video and imaging www.ti.com/video rfid www.ti-rfid.com omap applications processors www.ti.com/omap ti e2e community e2e.ti.com wireless connectivity www.ti.com/wirelessconnectivity mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2015, texas instruments incorporated

▲Up To Search▲

Price & Availability of SN74AHC4066NE4

	To Download SN74AHC4066NE4 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .